Copper cartridge cooling is a preliminary step of copper bond cooling. Here we incorporate the copper cartridges into the cooling bore under pressure in order that the copper remains in contact with the steel over its entire surface, which ensures improved heat dissipation. Copper cartridge cooling makes it possible for you to utilize temperature control close to the contour with a distance of 20 mm from the mold cavity. If a defect in the steel should arise, the cooling remains unaffected due to the additional layer of copper, which means no direct downtime (closed cycle). The danger of a “water shot” is also minimized.